Cabinet clears 4 more semiconductor projects worth Rs 4600 crore

New Delhi, Aug 12: The Union Cabinet chaired by Prime Minister Narendra Modi on Tuesday approved four additional semiconductor manufacturing projects under the India Semiconductor Mission (ISM), taking the total sanctioned projects to 10 with cumulative investments of about Rs 1.60 lakh crore in six states.

“These four new approved semiconductor projects would significantly contribute to making Atmanirbhar Bharat,” the Cabinet Secretariat said, noting growing demand from telecom, automotive, data centres, consumer electronics and industrial sectors.

The new proposals, from SiCSem, Continental Device India Pvt Ltd (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies, will involve ?4,600 crore in investment and create 2,034 skilled jobs. SiCSem and 3D Glass will set up units in Bhubaneshwar, Odisha; CDIL will expand its Mohali, Punjab plant; and ASIP will establish a facility in Andhra Pradesh. Projects include the country’s first commercial compound semiconductor fab and an advanced glass-based substrate packaging unit. “With the approval of these projects, the semiconductor ecosystem in the country will get a significant boost,” the government said, adding they will complement India’s chip design capabilities. “Already more than 60,000 students have availed the benefits of the talent development programme,” it noted.